CDLL5545BE3
vs
1N5545B
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
O-LELF-R2
|
HERMETICALLY SEALED, GLASS PACKAGE-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-213AA
|
DO-35
|
| JESD-30 Code |
O-LELF-R2
|
O-LALF-W2
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Reference Voltage-Nom |
30 V
|
30 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
WRAP AROUND
|
WIRE
|
| Terminal Position |
END
|
AXIAL
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
1 mA
|
1 mA
|
| Base Number Matches |
1
|
11
|
| Rohs Code |
|
No
|
| Factory Lead Time |
|
14 Weeks
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Case Connection |
|
ISOLATED
|
| Dynamic Impedance-Max |
|
100 Ω
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Qualification Status |
|
Not Qualified
|
| Reference Standard |
|
MIL-19500/437E
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare CDLL5545BE3 with alternatives
Compare 1N5545B with alternatives