CR0805F1151T1 vs BCR1/101151FE feature comparison

CR0805F1151T1 Chip Technologies Inc

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BCR1/101151FE TT electronics / BI Technologies

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Rohs Code No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer CHIP TECHNOLOGIES INC BI TECHNOLOGIES CORP
Package Description CHIP SMT, 0805
Reach Compliance Code unknown unknown
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8533.21.00.30
Construction Thick Film
JESD-609 Code e0
Manufacturer Series BCR
Mounting Feature SURFACE MOUNT
Number of Terminals 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Height 0.5 mm
Package Length 2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT
Package Width 1.25 mm
Packing Method TR, EMBOSSED
Rated Power Dissipation (P) 0.125 W
Rated Temperature 70 °C
Resistance 1150 Ω
Resistor Type FIXED RESISTOR
Series BCR
Size Code 0805
Surface Mount YES
Technology METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C
Terminal Finish TIN LEAD
Terminal Shape WRAPAROUND
Tolerance 1%
Working Voltage 150 V

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Compare BCR1/101151FE with alternatives