CR1206F17R8T1LF vs RM12F17R8BP feature comparison

CR1206F17R8T1LF Chip Technologies Inc

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RM12F17R8BP Cal-Chip Electronics

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Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer CHIP TECHNOLOGIES INC CAL-CHIP ELECTRONICS INC
Package Description CHIP CHIP
Reach Compliance Code unknown compliant
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30
Construction Glass Coat
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Height 0.55 mm
Package Length 3.1 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT
Package Width 1.55 mm
Packing Method BULK
Rated Power Dissipation (P) 0.25 W
Rated Temperature 70 °C
Resistance 17.8 Ω
Resistor Type FIXED RESISTOR
Size Code 1206
Surface Mount YES
Technology METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1%
Working Voltage 200 V

Compare CR1206F17R8T1LF with alternatives

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