CY7C1486BV33-167BGXC vs GS8644ZV72C-250 feature comparison

CY7C1486BV33-167BGXC Cypress Semiconductor

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GS8644ZV72C-250 GSI Technology

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP GSI TECHNOLOGY
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.4 ns 6.5 ns
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B209 R-PBGA-B209
JESD-609 Code e1
Memory Density 75497472 bit 75497472 bit
Memory IC Type STANDARD SRAM ZBT SRAM
Memory Width 72 72
Moisture Sensitivity Level 3 3
Number of Terminals 209 209
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX72 1MX72
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA209,11X19,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 220
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 3.14 V
Supply Current-Max 0.45 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Base Number Matches 1 1
Pbfree Code No
Part Package Code BGA
Package Description LBGA,
Pin Count 209
Additional Feature PIPELINED OR FLOW-THROUGH ARCHITECTURE
Length 22 mm
Number of Functions 1
Seated Height-Max 1.7 mm
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.6 V
Supply Voltage-Nom (Vsup) 1.8 V
Width 14 mm

Compare CY7C1486BV33-167BGXC with alternatives

Compare GS8644ZV72C-250 with alternatives