DAC43508RTER
vs
MAX5222EKA+
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
|
| Package Description |
WQFN-16
|
|
| Reach Compliance Code |
compliant
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Analog Output Voltage-Max |
5.5 V
|
5.5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
S-PQCC-N16
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
e3
|
| Length |
3 mm
|
2.9 mm
|
| Linearity Error-Max (EL) |
0.3906%
|
0.3906%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LSSOP
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.8 mm
|
1.45 mm
|
| Settling Time-Nom (tstl) |
10 µs
|
10 µs
|
| Supply Current-Max |
5 mA
|
|
| Supply Voltage-Nom |
2.7 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
3 mm
|
1.625 mm
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
8-SOT_23-N/A
|
| Pin Count |
|
8
|
| Manufacturer Package Code |
|
8-SOT_23-N/A
|
| Date Of Intro |
|
2000-05-12
|
| Technology |
|
BICMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare DAC43508RTER with alternatives
Compare MAX5222EKA+ with alternatives