DS1245ABP-70+
vs
DS1245ABP-70IND+
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
DMA
|
DMA
|
Package Description |
, MODULE,34LEAD,1.0
|
ROHS COMPLIANT, POWERCAP MODULE-34
|
Pin Count |
34
|
34
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8473.30.11.40
|
8473.30.11.40
|
Factory Lead Time |
4 Weeks
|
|
Access Time-Max |
70 ns
|
70 ns
|
JESD-30 Code |
R-XDMA-C34
|
R-XDMA-C34
|
JESD-609 Code |
e3
|
e3
|
Length |
25.019 mm
|
25.019 mm
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
NON-VOLATILE SRAM MODULE
|
NON-VOLATILE SRAM MODULE
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
34
|
34
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
128KX8
|
128KX8
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Equivalence Code |
MODULE,34LEAD,1.0
|
MODULE,34LEAD,1.0
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
6.85 mm
|
6.85 mm
|
Standby Current-Max |
0.0006 A
|
0.0006 A
|
Supply Current-Max |
0.085 mA
|
0.085 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
23.495 mm
|
23.495 mm
|
Base Number Matches |
4
|
2
|
|
|
|