DS21554L+
vs
DS21552LN+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Transferred
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
100-LQFP-14X14X1.4
|
QFP
|
| Package Description |
14 X 14 MM, ROHS COMPLIANT, LQFP-100
|
LFQFP, QFP100,.63SQ,20
|
| Pin Count |
100
|
100
|
| Manufacturer Package Code |
100-LQFP-14X14X1.4
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2001-07-24
|
1998-04-02
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Carrier Type |
CEPT PCM-30/E-1
|
T-1(DS1)
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e3
|
e3
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP100,.63SQ,20
|
QFP100,.63SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
PCM TRANSCEIVER
|
PCM TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare DS21554L+ with alternatives
Compare DS21552LN+ with alternatives