EDI81256P45FB vs L7C197DMB45 feature comparison

EDI81256P45FB Electronic Designs Inc

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L7C197DMB45 LOGIC Devices Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ELECTRONIC DESIGNS INC LOGIC DEVICES INC
Reach Compliance Code unknown unknown
Access Time-Max 45 ns 45 ns
I/O Type SEPARATE
JESD-30 Code R-CDFP-F28 R-CDIP-T24
JESD-609 Code e0
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 24
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 256KX1 256KX1
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DIP
Package Equivalence Code FL28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.0015 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Package Description DIP,
Pin Count 24
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Additional Feature AUTOMATIC POWER-DOWN
Length 30.48 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Seated Height-Max 4.953 mm
Width 7.62 mm

Compare EDI81256P45FB with alternatives

Compare L7C197DMB45 with alternatives