EFM32WG295F128-B-BGA120
vs
EFM32WG295F128-B-BGA120T
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
Package Description |
VFBGA, BGA120,13X13,20
|
VFBGA, BGA120,13X13,20
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2019-11-15
|
2019-11-15
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
16
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
NO
|
CPU Family |
CORTEX-M4
|
CORTEX-M4
|
Clock Frequency-Max |
48 MHz
|
48 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
16
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-PBGA-B120
|
S-PBGA-B120
|
JESD-609 Code |
e1
|
|
Length |
7 mm
|
7 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of DMA Channels |
12
|
12
|
Number of External Interrupts |
16
|
16
|
Number of I/O Lines |
93
|
93
|
Number of Serial I/Os |
7
|
|
Number of Terminals |
120
|
120
|
Number of Timers |
5
|
4
|
On Chip Data RAM Width |
8
|
32
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA120,13X13,20
|
BGA120,13X13,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
RAM (bytes) |
32768
|
32768
|
RAM (words) |
8192
|
8192
|
ROM (words) |
131072
|
131072
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1 mm
|
1 mm
|
Speed |
48 MHz
|
48 MHz
|
Supply Voltage-Max |
3.8 V
|
3.8 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
7 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
3
|
1
|
|
|
|
Compare EFM32WG295F128-B-BGA120 with alternatives
Compare EFM32WG295F128-B-BGA120T with alternatives