EFM32WG890F128-BGA112R
vs
EFM32WG890F128-BGA112
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
| Package Description |
LFBGA,
|
BGA-112
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
28
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
48 MHz
|
48 MHz
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
16
|
| Length |
10 mm
|
10 mm
|
| Number of I/O Lines |
90
|
90
|
| Number of Terminals |
112
|
112
|
| PWM Channels |
YES
|
YES
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Speed |
48 MHz
|
48 MHz
|
| Supply Voltage-Max |
3.8 V
|
3.8 V
|
| Supply Voltage-Min |
1.98 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
10 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
3
|
| DAC Channels |
|
YES
|
| JESD-30 Code |
|
S-PBGA-B112
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| ROM (words) |
|
131072
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.3 mm
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|