EPM7512AEFI256-10 vs ISPLSI5512VE-100LF256I feature comparison

EPM7512AEFI256-10 Altera Corporation

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ISPLSI5512VE-100LF256I Lattice Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ALTERA CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description FINE LINE, BGA-256 THERMALLY ENHANCED, FBGA-256
Pin Count 256 256
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
Additional Feature YES YES
Clock Frequency-Max 87 MHz 67 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 212 192
Number of Macro Cells 512 512
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 0 DEDICATED INPUTS, 212 I/O 0 DEDICATED INPUTS, 192 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 30
Width 17 mm 17 mm
Base Number Matches 2 1

Compare EPM7512AEFI256-10 with alternatives

Compare ISPLSI5512VE-100LF256I with alternatives