GL555 vs TLC556IDRG4 feature comparison

GL555 LG Semicon Co Ltd

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TLC556IDRG4 Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Transferred Lifetime Buy
Ihs Manufacturer LG SEMICON CO LTD TEXAS INSTRUMENTS INC
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T8 R-PDSO-G14
JESD-609 Code e0 e4
Number of Terminals 8 14
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code SOIC
Package Description SOP, SOP14,.25
Pin Count 14
Samacsys Manufacturer Texas Instruments
Additional Feature IT CAN ALSO OPERATE AT 5V OR 15V NOMINALS
Analog IC - Other Type PULSE; RECTANGULAR
Length 8.65 mm
Moisture Sensitivity Level 1
Number of Functions 2
Output Frequency-Max 1.2 MHz
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.75 mm
Supply Current-Max (Isup) 1.2 mA
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 3 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

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