GS71108AGP-10 vs CY7C1019BV33-10ZC feature comparison

GS71108AGP-10 GSI Technology

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CY7C1019BV33-10ZC Cypress Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY CYPRESS SEMICONDUCTOR CORP
Part Package Code TSOP2 TSOP2
Package Description LSOP, TSOP2,
Pin Count 32 32
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 10 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
Length 20.95 mm 20.95 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSOP TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.27 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.63 V
Supply Voltage-Min (Vsup) 3 V 2.97 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish PURE MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 4 1
Pbfree Code No
JESD-609 Code e0
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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