GS8162Z72CC-250 vs GS8170DW72C-250T feature comparison

GS8162Z72CC-250 GSI Technology

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GS8170DW72C-250T GSI Technology

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, 14 X 22 MM, 1 MM PITCH, BGA-209
Pin Count 209 209
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 5.5 ns 2.1 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B209 R-PBGA-B209
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type ZBT SRAM STANDARD SRAM
Memory Width 72 72
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX72 256KX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max (Vsup) 2.7 V 1.95 V
Supply Voltage-Min (Vsup) 2.3 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 8 1

Compare GS8162Z72CC-250 with alternatives

Compare GS8170DW72C-250T with alternatives