GS82582Q36GE-333I vs GS82582T37GE-333T feature comparison

GS82582Q36GE-333I GSI Technology

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GS82582T37GE-333T GSI Technology

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Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Package Description LBGA, LBGA, BGA165,11X15,40
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 0.45 ns 0.45 ns
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 17 mm
Memory Density 301989888 bit 301989888 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 8MX36 8MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 2 1
Rohs Code Yes
Additional Feature PIPELINED ARCHITECTURE; LATE WRITE
Clock Frequency-Max (fCLK) 333 MHz
I/O Type COMMON
Number of Ports 1
Operating Temperature-Max 85 °C
Operating Temperature-Min
Output Characteristics 3-STATE
Output Enable NO
Package Equivalence Code BGA165,11X15,40
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reverse Pinout NO
Standby Voltage-Min 1.7 V
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare GS82582Q36GE-333I with alternatives

Compare GS82582T37GE-333T with alternatives