GS8641ZV36GE-300 vs CY7C1470V25-200AXI feature comparison

GS8641ZV36GE-300 GSI Technology

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CY7C1470V25-200AXI Cypress Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer GSI TECHNOLOGY CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA QFP
Package Description BGA, LQFP, QFP100,.63X.87
Pin Count 165 100
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 5.5 ns 3 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PQFP-G100
JESD-609 Code e1 e3
Length 17 mm 20 mm
Memory Density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36 2MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 2 V 2.625 V
Supply Voltage-Min (Vsup) 1.6 V 2.375 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER MATTE TIN
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 15 mm 14 mm
Base Number Matches 4 1
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code QFP100,.63X.87
Seated Height-Max 1.6 mm
Standby Voltage-Min 2.38 V
Time@Peak Reflow Temperature-Max (s) 40

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