GS8642ZV18GF-300 vs CY7C1473BV25-100BZI feature comparison

GS8642ZV18GF-300 GSI Technology

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CY7C1473BV25-100BZI Cypress Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description BGA, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 5.5 ns 8.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1
Memory Density 75497472 bit 75497472 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX18 4MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 2 V 2.625 V
Supply Voltage-Min (Vsup) 1.6 V 2.375 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 4 1
Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON
Length 17 mm
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Seated Height-Max 1.4 mm
Standby Current-Max 0.12 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.275 mA
Terminal Pitch 1 mm
Width 15 mm

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