HD74LVCC3245AT
vs
5962H9656901QRA
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HITACHI LTD
|
AEROFLEX COLORADO SPRINGS
|
| Part Package Code |
TSSOP
|
DIP
|
| Package Description |
TSSOP,
|
DIP,
|
| Pin Count |
24
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO REQUIRES A SECONDARY SUPPLY OF 3.0V TO 5.5V
|
|
| Family |
LVC/LCX/Z
|
ACT
|
| JESD-30 Code |
R-PDSO-G24
|
R-CDIP-T20
|
| Length |
7.8 mm
|
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS DRIVER
|
| Number of Bits |
8
|
4
|
| Number of Functions |
1
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
TSSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Propagation Delay (tpd) |
11.2 ns
|
13 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
| Total Dose |
|
1M Rad(Si) V
|
|
|
|
Compare HD74LVCC3245AT with alternatives
Compare 5962H9656901QRA with alternatives