HEF4081BDF vs HD14081BRP feature comparison

HEF4081BDF NXP Semiconductors

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HD14081BRP Renesas Electronics Corporation

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Part Package Code DIP SOIC
Package Description DIP, SOP,
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Load Capacitance (CL) 50 pF
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 110 ns 320 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Length 8.65 mm

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