HN58X2532NI
vs
M24C32-RMB6GP
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
STMICROELECTRONICS
|
| Part Package Code |
SON
|
SOIC
|
| Package Description |
VSON, FL8,.15,25
|
2 X 3 MM, ROHS COMPLIANT, MLP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
3 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
10
|
40
|
| Endurance |
100000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-PDSO-N8
|
R-XDSO-N8
|
| JESD-609 Code |
e0
|
|
| Length |
3.6 mm
|
3 mm
|
| Memory Density |
32768 bit
|
32768 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
4096 words
|
4096 words
|
| Number of Words Code |
4000
|
4000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
4KX8
|
4KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VSON
|
VSON
|
| Package Equivalence Code |
FL8,.15,25
|
SOLCC8,.11,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.6 mm
|
| Serial Bus Type |
SPI
|
I2C
|
| Standby Current-Max |
0.000003 A
|
0.000001 A
|
| Supply Current-Max |
0.0035 mA
|
0.003 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3 mm
|
2 mm
|
| Write Cycle Time-Max (tWC) |
8 ms
|
10 ms
|
| Write Protection |
HARDWARE/SOFTWARE
|
HARDWARE
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| I2C Control Byte |
|
1010DDDR
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Screening Level |
|
AEC-Q100
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HN58X2532NI with alternatives
Compare M24C32-RMB6GP with alternatives