HP05BB223KN
vs
HT05BB223KC
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
KEMET ELECTRONICS CORP
|
KEMET ELECTRONICS CORP
|
| Package Description |
, 2010
|
, 2010
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Capacitance |
0.022 µF
|
0.022 µF
|
| Capacitor Type |
CERAMIC CAPACITOR
|
CERAMIC CAPACITOR
|
| Dielectric Material |
CERAMIC
|
CERAMIC
|
| Height |
5.08 mm
|
5.08 mm
|
| JESD-609 Code |
e0
|
e0
|
| Length |
5.08 mm
|
5.08 mm
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Multilayer |
Yes
|
Yes
|
| Negative Tolerance |
10%
|
10%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Style |
Radial
|
Radial
|
| Packing Method |
Bulk
|
Bulk
|
| Positive Tolerance |
10%
|
10%
|
| Rated (DC) Voltage (URdc) |
50 V
|
50 V
|
| Size Code |
2010
|
2010
|
| Surface Mount |
NO
|
NO
|
| Temperature Characteristics Code |
X7R
|
X7R
|
| Temperature Coefficient |
15% ppm/°C
|
15% ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Shape |
WIRE
|
WIRE
|
| Width |
2.54 mm
|
2.54 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare HP05BB223KN with alternatives
Compare HT05BB223KC with alternatives