HUM2020B
vs
HUM2020B
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, AXIAL PACKAGE-2
|
HERMETIC SEALED, AXIAL PACKAGE-2
|
| Reach Compliance Code |
compliant
|
unknown
|
| Additional Feature |
HIGH RELIABILITY
|
HIGH RELIABILITY
|
| Application |
SWITCHING
|
SWITCHING
|
| Breakdown Voltage-Min |
2000 V
|
2000 V
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
4 pF
|
4 pF
|
| Diode Capacitance-Nom |
3.4 pF
|
3.4 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
0.2 Ω
|
0.2 Ω
|
| Diode Res Test Current |
500 mA
|
500 mA
|
| Diode Res Test Frequency |
4 MHz
|
4 MHz
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| JESD-30 Code |
O-XALF-W2
|
O-XALF-W2
|
| JESD-609 Code |
e0
|
e0
|
| Minority Carrier Lifetime-Nom |
30 µs
|
30 µs
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Power Dissipation-Max |
13 W
|
13 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Test Voltage |
100 V
|
100 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
1
|
2
|
| Pin Count |
|
2
|
| Manufacturer Package Code |
|
CASE B
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
|
|
|