ICM7555CD,602 vs MC1455BDG feature comparison

ICM7555CD,602 NXP Semiconductors

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MC1455BDG onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ON SEMICONDUCTOR
Part Package Code SOIC SOIC
Package Description SOP, SOP8,.25 SOP, SOP8,.25
Pin Count 8 8
Manufacturer Package Code SOT96-1
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE PULSE; RECTANGULAR
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Frequency-Max 0.5 MHz
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.25 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 235
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 16 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS BIPOLAR
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
Moisture Sensitivity Level 1

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