IDT723622L15PQF9
vs
LH543611P-18
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
SHARP CORP
|
Part Package Code |
QFP
|
|
Package Description |
BQFP,
|
BQFP,
|
Pin Count |
132
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.71
|
|
Access Time-Max |
10 ns
|
13 ns
|
Additional Feature |
MAILBOX
|
RETRANSMIT
|
Cycle Time |
15 ns
|
18 ns
|
JESD-30 Code |
S-PQFP-G132
|
S-PQFP-G132
|
JESD-609 Code |
e0
|
e0
|
Length |
24.13 mm
|
24.13 mm
|
Memory Density |
9216 bit
|
36864 bit
|
Memory IC Type |
BI-DIRECTIONAL FIFO
|
|
Memory Width |
36
|
36
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
132
|
132
|
Number of Words |
256 words
|
1024 words
|
Number of Words Code |
256
|
1000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
256X36
|
1KX36
|
Output Characteristics |
3-STATE
|
|
Output Enable |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BQFP
|
BQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, BUMPER
|
FLATPACK, BUMPER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.572 mm
|
4.57 mm
|
Supply Current-Max |
0.4 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
MOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.13 mm
|
24.13 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IDT723622L15PQF9 with alternatives
Compare LH543611P-18 with alternatives