IHLP5050EZER6R8M01
vs
BMMA001313506R8MX1
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
PULSE ELECTRONICS CORP
|
Package Description |
CHIP
|
CHIP
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
10 Weeks
|
12 Weeks
|
Samacsys Manufacturer |
Vishay
|
|
Case/Size Code |
5251
|
5251
|
Construction |
Rectangular
|
Rectangular
|
Core Material |
COMPOSITE
|
Magnetic
|
DC Resistance |
0.0185 Ω
|
0.0185 Ω
|
Inductance-Nom (L) |
6.8 µH
|
6.8 µH
|
Inductor Application |
HIGH CURRENT INDUCTOR
|
POWER INDUCTOR
|
Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
JESD-609 Code |
e3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
5 mm
|
5 mm
|
Package Length |
13.2 mm
|
13.2 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
12.9 mm
|
12.9 mm
|
Packing Method |
TR, 13 Inch
|
TR, 13 Inch
|
Rated Current-Max |
11 A
|
11 A
|
Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Shielded |
YES
|
YES
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
MATTE TIN OVER NICKEL
|
|
Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Test Frequency |
0.1 MHz
|
0.1 MHz
|
Tolerance |
20%
|
20%
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IHLP5050EZER6R8M01 with alternatives
Compare BMMA001313506R8MX1 with alternatives