IS66WVC4M16ALL-7010BLI
vs
MT45W4MV16BFB-608LWT
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
MICRON TECHNOLOGY INC
|
| Part Package Code |
DSBGA
|
BGA
|
| Package Description |
VFBGA, BGA54,6X9,30
|
VFBGA,
|
| Pin Count |
54
|
54
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Samacsys Manufacturer |
Integrated Silicon Solution Inc.
|
|
| Access Time-Max |
70 ns
|
60 ns
|
| Additional Feature |
IT ALSO OPERATES SYNCHRONOUS BURST MODE
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PBGA-B54
|
R-PBGA-B54
|
| JESD-609 Code |
e1
|
e0
|
| Length |
8 mm
|
8 mm
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
PSEUDO STATIC RAM
|
PSEUDO STATIC RAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
54
|
54
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Organization |
4MX16
|
4MX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA54,6X9,30
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Standby Current-Max |
0.00001 A
|
|
| Supply Current-Max |
0.035 mA
|
|
| Supply Voltage-Max (Vsup) |
1.95 V
|
1.95 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD SILVER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.75 mm
|
0.75 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
6 mm
|
6 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare IS66WVC4M16ALL-7010BLI with alternatives
Compare MT45W4MV16BFB-608LWT with alternatives