ISL2101AAR3Z
vs
ISL2101AAR3ZT
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
DFN, SOIC
|
SON
|
| Package Description |
HVSON, SOLCC10,.11,20
|
3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-229-WEED-3, DFN-9
|
| Pin Count |
9, 8
|
9
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
26 Weeks
|
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
S-PDSO-N9
|
S-PDSO-N9
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Peak Current Limit-Nom |
2 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC10,.11,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max |
14 V
|
14 V
|
| Supply Voltage-Min |
9 V
|
9 V
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Turn-off Time |
0.06 µs
|
0.06 µs
|
| Turn-on Time |
0.06 µs
|
0.06 µs
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
|
|
|