ISL54224IRUZ-T7A
vs
ISL54225IRTZ-T
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
DFN, uTQFN
|
DFN, uTQFN
|
| Package Description |
QCCN, LCC10,.06X.07,16
|
SON, SOLCC10,.12,20
|
| Pin Count |
10, 10
|
10, 10
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks
|
26 Weeks
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
R-PQCC-N10
|
S-PDSO-N10
|
| JESD-609 Code |
e4
|
e3
|
| Length |
1.8 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
10
|
10
|
| On-state Resistance-Max (Ron) |
25 Ω
|
25 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
SON
|
| Package Equivalence Code |
LCC10,.06X.07,16
|
SOLCC10,.12,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.55 mm
|
0.8 mm
|
| Surface Mount |
YES
|
YES
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.4 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
|
|
|