ISP1161BM
vs
ISP1161A1BD
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ST-ERICSSON
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LFQFP, QFP64,.35SQ,16
|
LFQFP, QFP64,.47SQ,20
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
2
|
2
|
| Bus Compatibility |
SH-3; SH-4; ARM7; ARM9; STRONGARM
|
SH-3; SH-4; ARM7; ARM9; STRONGARM; MIPS
|
| Clock Frequency-Max |
6 MHz
|
6 MHz
|
| Data Transfer Rate-Max |
15 MBps
|
15 MBps
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| Length |
7 mm
|
10 mm
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP64,.35SQ,16
|
QFP64,.47SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
6
|
| Additional Feature |
|
ALSO OPERATES AT 5V SUPPLY
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Current-Max |
|
47 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare ISP1161BM with alternatives
Compare ISP1161A1BD with alternatives