IXDI602SI
vs
IXDI602SI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
IXYS CORP
|
IXYS INTEGRATED CIRCUITS DIVISION
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
MS-012BA, SOIC-8
|
ROHS COMPLIANT, MS-012BA, SOIC-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| High Side Driver |
NO
|
NO
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| Length |
4.9 mm
|
4.9 mm
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Peak Current Limit-Nom |
2 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSOP
|
HSOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
SMALL OUTLINE, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Max |
35 V
|
35 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
18 V
|
18 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Turn-off Time |
0.038 µs
|
0.075 µs
|
| Turn-on Time |
0.04 µs
|
0.075 µs
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
4
|
4
|
|
|
|
Compare IXDI602SI with alternatives
Compare IXDI602SI with alternatives