IXFA20N50P3 vs IRF460PBF feature comparison

IXFA20N50P3 IXYS Corporation

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IRF460PBF Infineon Technologies AG

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer IXYS CORP INFINEON TECHNOLOGIES AG
Part Package Code D2PAK
Package Description TO-263AA, 3 PIN FLANGE MOUNT, O-MBFM-P2
Pin Count 4
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
Additional Feature AVALANCHE RATED
Avalanche Energy Rating (Eas) 300 mJ 1200 mJ
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 500 V 500 V
Drain Current-Max (ID) 20 A 21 A
Drain-source On Resistance-Max 0.3 Ω 0.31 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-263AB TO-204AE
JESD-30 Code R-PSSO-G2 O-MBFM-P2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY METAL
Package Shape RECTANGULAR ROUND
Package Style SMALL OUTLINE FLANGE MOUNT
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation-Max (Abs) 380 W
Pulsed Drain Current-Max (IDM) 40 A 84 A
Surface Mount YES NO
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING PIN/PEG
Terminal Position SINGLE BOTTOM
Time@Peak Reflow Temperature-Max (s) 10 NOT SPECIFIED
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 1

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