JAN1N5768
vs
1N5768
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED, CERAMIC, FLAT PACK-10
|
HERMETIC SEALED, CERAMIC, FLAT PACK-10
|
| Reach Compliance Code |
compliant
|
unknown
|
| Configuration |
COMMON CATHODE, 8 ELEMENTS
|
COMMON CATHODE, 8 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
R-CDSO-F10
|
R-CDSO-F10
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
8
|
8
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Output Current-Max |
0.3 A
|
0.3 A
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/474
|
|
| Reverse Recovery Time-Max |
0.02 µs
|
0.02 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
9
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
10
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.70
|
|
|
|
Compare JAN1N5768 with alternatives
Compare 1N5768 with alternatives