JAN1N5819UR-1
vs
JANS1N5819UR-1
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
COMPENSATED DEVICES INC
|
COMPENSATED DEVICES INC
|
Package Description |
HERMETIC SEALED PACKAGE-2
|
HERMETIC SEALED PACKAGE-2
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
DO-213AB
|
DO-213AB
|
JESD-30 Code |
O-XELF-R2
|
O-XELF-R2
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/586
|
MIL-19500/586F
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Base Number Matches |
5
|
7
|
|
|
|