JANHCA1N753D
vs
JAN1N753D-1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Case Connection |
CATHODE
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Style |
UNCASED CHIP
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
0.5 W
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/115K
|
MIL-19500/127
|
| Reference Voltage-Nom |
8.2 V
|
6.2 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Position |
UNSPECIFIED
|
AXIAL
|
| Voltage Tol-Max |
2%
|
1%
|
| Working Test Current |
31 mA
|
20 mA
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Package Description |
|
HERMETIC SEALED, GLASS PACKAGE-2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| JEDEC-95 Code |
|
DO-35
|
| JESD-30 Code |
|
O-LALF-W2
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Terminal Form |
|
WIRE
|
|
|
|
Compare JANHCA1N753D with alternatives
Compare JAN1N753D-1 with alternatives