JANKCA1N5527C vs JANHCA1N5527C feature comparison

JANKCA1N5527C Microsemi Corporation

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JANHCA1N5527C Compensated Devices Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP COMPENSATED DEVICES INC
Part Package Code DIE
Package Description DIE-2 DIE-2
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Additional Feature METALLURGICALLY BONDED METALLURGICALLY BONDED
Case Connection CATHODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 35 Ω
JESD-30 Code S-XXUC-N2 S-XXUC-N2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape SQUARE SQUARE
Package Style UNCASED CHIP UNCASED CHIP
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/437E MIL-19500/437E
Reference Voltage-Nom 7.5 V 7.5 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position UNSPECIFIED UNSPECIFIED
Voltage Tol-Max 2% 2%
Working Test Current 1 mA 1 mA
Base Number Matches 3 4

Compare JANKCA1N5527C with alternatives

Compare JANHCA1N5527C with alternatives