JANS1N5819UR-1
vs
JANTXV1N5819-1
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DO-213AB
|
|
Package Description |
HERMETIC SEALED PACKAGE-2
|
HERMETIC SEALED PACKAGE-2
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.80
|
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Additional Feature |
METALLURGICALLY BONDED
|
HIGH RELIABILITY
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
DO-213AB
|
DO-41
|
JESD-30 Code |
O-XELF-R2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e0
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
UNSPECIFIED
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Standard |
MIL-19500/586F
|
MIL-PRF-19500; MIL-STD-750
|
Rep Pk Reverse Voltage-Max |
45 V
|
45 V
|
Surface Mount |
YES
|
NO
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WIRE
|
Terminal Position |
END
|
AXIAL
|
Base Number Matches |
7
|
7
|
Factory Lead Time |
|
24 Weeks
|
Application |
|
GENERAL PURPOSE
|
Forward Voltage-Max (VF) |
|
0.49 V
|
Non-rep Pk Forward Current-Max |
|
25 A
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-65 °C
|
Reverse Current-Max |
|
50 µA
|
Reverse Test Voltage |
|
45 V
|
|
|
|
Compare JANS1N5819UR-1 with alternatives
Compare JANTXV1N5819-1 with alternatives