JANTXV1N6461US
vs
JANTX1N6461US
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
SEMTECH CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SURFACE MOUNT PACKAGE-2
|
SURFACE MOUNT PACKAGE-2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Factory Lead Time |
18 Weeks
|
25 Weeks
|
| Samacsys Manufacturer |
SEMTECH
|
Microchip
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Clamping Voltage-Max |
9 V
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
O-XELF-R2
|
O-XELF-R2
|
| Non-rep Peak Rev Power Dis-Max |
500 W
|
500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
2.5 W
|
2.5 W
|
| Qualification Status |
Qualified
|
Qualified
|
| Reference Standard |
MIL-19500/551C
|
MIL-19500/551C
|
| Rep Pk Reverse Voltage-Max |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare JANTXV1N6461US with alternatives
Compare JANTX1N6461US with alternatives