KMC7448VU1267ND vs TSXPC750AMGSU/T10LH feature comparison

KMC7448VU1267ND Freescale Semiconductor

Buy Now Datasheet

TSXPC750AMGSU/T10LH Atmel Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC ATMEL CORP
Part Package Code LGA CGA
Package Description 25 X 25 MM, 1.90 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 CGA,
Pin Count 360 360
Reach Compliance Code not_compliant compliant
ECCN Code 3A991 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Additional Feature LOW POWER TAKEN FROM SLEEP MODE
Address Bus Width 36 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 200 MHz 83.3 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B360 S-CBGA-X360
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Terminals 360 360
Operating Temperature-Max 105 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA CGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 4.2 mm
Speed 1267 MHz 233 MHz
Supply Voltage-Max 1.15 V 2.7 V
Supply Voltage-Min 1.05 V 2.5 V
Supply Voltage-Nom 1.1 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Form BALL UNSPECIFIED
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

Compare KMC7448VU1267ND with alternatives

Compare TSXPC750AMGSU/T10LH with alternatives