KMM372E803BS-6 vs HB52E89EM-B6 feature comparison

KMM372E803BS-6 Samsung Semiconductor

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HB52E89EM-B6 Hitachi Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC HITACHI LTD
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode FAST PAGE WITH EDO SINGLE BANK PAGE BURST
Access Time-Max 60 ns 6 ns
Additional Feature CAS BEFORE RAS REFRESH; RAS ONLY/HIDDEN REFRESH
I/O Type COMMON COMMON
JESD-30 Code R-XDMA-N168 R-XDMA-N168
Memory Density 603979776 bit 603979776 bit
Memory IC Type EDO DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 168
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 65 °C
Operating Temperature-Min
Organization 8MX72 8MX72
Output Characteristics 3-STATE 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM168 DIMM168
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 4096 4096
Standby Current-Max 0.03 A 0.018 A
Supply Current-Max 0.99 mA 1.305 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIMM
Package Description DIMM, DIMM168
Pin Count 168
Clock Frequency-Max (fCLK) 100 MHz

Compare KMM372E803BS-6 with alternatives

Compare HB52E89EM-B6 with alternatives