KMPC870ZT66
vs
MPC823CZC25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
PLASTIC, BGA-256
BGA,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
26
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
Length
23 mm
17 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HBGA
BGA
Package Equivalence Code
BGA256,16X16,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
1.75 mm
Speed
66 MHz
Supply Voltage-Max
1.9 V
3.6 V
Supply Voltage-Min
1.7 V
3 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
17 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Part Package Code
BGA
Pin Count
256
Clock Frequency-Max
25 MHz
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Temperature Grade
INDUSTRIAL
Compare KMPC870ZT66 with alternatives
Compare MPC823CZC25 with alternatives