KMPC870ZT66
vs
MPC823CZC25
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
Package Description |
PLASTIC, BGA-256
|
BGA,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
26
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
|
Length |
23 mm
|
17 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
256
|
256
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.54 mm
|
1.75 mm
|
Speed |
66 MHz
|
|
Supply Voltage-Max |
1.9 V
|
3.6 V
|
Supply Voltage-Min |
1.7 V
|
3 V
|
Supply Voltage-Nom |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
23 mm
|
17 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
Clock Frequency-Max |
|
25 MHz
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare KMPC870ZT66 with alternatives
Compare MPC823CZC25 with alternatives