LF353N
vs
LM358MENG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
NATIONAL SEMICONDUCTOR CORP
Package Description
PLASTIC, DIP-8
SOP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.008 µA
0.5 µA
Common-mode Reject Ratio-Min
70 dB
Common-mode Reject Ratio-Nom
100 dB
85 dB
Input Offset Voltage-Max
13000 µV
9000 µV
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e0
Length
9.78 mm
4.9 mm
Neg Supply Voltage Limit-Max
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
1.75 mm
Slew Rate-Nom
13 V/us
0.1 V/us
Supply Voltage Limit-Max
18 V
32 V
Supply Voltage-Nom (Vsup)
15 V
5 V
Surface Mount
NO
YES
Technology
JFET
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
4000
1000
Voltage Gain-Min
25000
Width
7.62 mm
3.9 mm
Base Number Matches
11
2
Part Package Code
SOIC
Pin Count
8
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