LL1608-FSL22NJ
vs
LL1608-FSL6N8J
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
TOKO INC
|
TOKO INC
|
| Package Description |
0603
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8504.50.80.00
|
8504.50.80.00
|
| Case/Size Code |
0603
|
0603
|
| Construction |
Multilayer Chip
|
Multilayer Chip
|
| Core Material |
CERAMIC
|
CERAMIC
|
| DC Resistance |
0.54 Ω
|
0.22 Ω
|
| Inductance-Nom (L) |
0.022 µH
|
0.0068 µH
|
| Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| JESD-609 Code |
e3
|
e3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Height |
0.8 mm
|
0.8 mm
|
| Package Length |
1.6 mm
|
1.6 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.8 mm
|
0.8 mm
|
| Packing Method |
TR
|
TR
|
| Quality Factor-Min (at L-nom) |
13
|
12
|
| Rated Current-Max |
0.6 A
|
0.6 A
|
| Self Resonance Frequency |
2500 MHz
|
4700 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Shielded |
NO
|
NO
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Test Frequency |
100 MHz
|
100 MHz
|
| Tolerance |
5%
|
5%
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LL1608-FSL22NJ with alternatives
Compare LL1608-FSL6N8J with alternatives