LM13600AN vs NE5517AN feature comparison

LM13600AN National Semiconductor Corporation

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NE5517AN NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture TRANSCONDUCTANCE TRANSCONDUCTANCE
Average Bias Current-Max (IIB) 5 µA 7 µA
Bias Current-Max (IIB) @25C 5 µA 5 µA
Common-mode Reject Ratio-Min 80 dB
Common-mode Reject Ratio-Nom 110 dB 110 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 1000 µV 5000 µV
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0
Length 21.755 mm 19.025 mm
Low-Offset NO NO
Neg Supply Voltage Limit-Max -22 V -22 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.2 mm
Slew Rate-Nom 50 V/us 50 V/us
Supply Voltage Limit-Max 22 V 22 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 2000 2000
Width 7.62 mm 7.62 mm
Base Number Matches 5 3
Moisture Sensitivity Level 1
Supply Current-Max 4 mA

Compare LM13600AN with alternatives

Compare NE5517AN with alternatives