LM20134MH/NOPB
vs
LM20134MHX
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
HSSOP, TSSOP16,.25
|
TSSOP-16
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.95 V
|
2.95 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
7.9 A
|
7.9 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSSOP
|
HSSOP
|
| Package Equivalence Code |
TSSOP16,.25
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Switching Frequency-Max |
1500 kHz
|
460 kHz
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare LM20134MH/NOPB with alternatives
Compare LM20134MHX with alternatives