LMC662CN vs LMC662AID feature comparison

LMC662CN National Semiconductor Corporation

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LMC662AID National Semiconductor Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description PLASTIC, DIP-8 DIP,
Pin Count 8 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.000002 µA 0.000004 µA
Bias Current-Max (IIB) @25C 0.000002 µA
Common-mode Reject Ratio-Min 63 dB
Common-mode Reject Ratio-Nom 83 dB 83 dB
Frequency Compensation YES
Input Offset Voltage-Max 6300 µV 3300 µV
JESD-30 Code R-PDIP-T8 R-CDIP-T8
JESD-609 Code e0
Length 9.817 mm
Low-Bias YES
Low-Offset NO
Micropower YES
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.715 mm
Slew Rate-Min 0.8 V/us
Slew Rate-Nom 1.1 V/us 1.1 V/us
Supply Current-Max 1.8 mA 1.5 mA
Supply Voltage Limit-Max 16 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 1400 1400
Voltage Gain-Min 50000
Width 7.62 mm 7.62 mm
Base Number Matches 2 1

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