LMC7111BIN
vs
LMC7111BIN/NOPB
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
0.300 INCH, MDIP-8
|
DIP,
|
Reach Compliance Code |
compliant
|
compliant
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Average Bias Current-Max (IIB) |
0.000001 µA
|
0.000001 µA
|
Bias Current-Max (IIB) @25C |
0.000001 µA
|
|
Common-mode Reject Ratio-Nom |
85 dB
|
85 dB
|
Frequency Compensation |
YES
|
|
Input Offset Voltage-Max |
7000 µV
|
7000 µV
|
JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
JESD-609 Code |
e0
|
e3
|
Length |
9.817 mm
|
9.817 mm
|
Low-Bias |
YES
|
|
Low-Offset |
NO
|
|
Micropower |
YES
|
|
Moisture Sensitivity Level |
1
|
1
|
Neg Supply Voltage Limit-Max |
|
|
Neg Supply Voltage-Nom (Vsup) |
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP8,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Packing Method |
RAIL
|
|
Power |
NO
|
|
Programmable Power |
NO
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Slew Rate-Min |
0.01 V/us
|
|
Slew Rate-Nom |
0.015 V/us
|
0.015 V/us
|
Supply Current-Max |
0.065 mA
|
|
Supply Voltage Limit-Max |
11 V
|
11 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
2.7 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Unity Gain BW-Nom |
40
|
40
|
Wideband |
NO
|
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.33.00.01
|
|
|
|