LMV1012UP-07
vs
LMV1012UP-07/NOPB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
VFBGA, BGA4,2X2,20
|
0.40 MM HEIGHT, LEAD FREE, MO-211CA, MICRO, SMD-4
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
95000 kHz
|
95000 kHz
|
| Consumer IC Type |
AUDIO PREAMPLIFIER
|
AUDIO PREAMPLIFIER
|
| Gain |
7.8 dB
|
7.8 dB
|
| Harmonic Distortion |
0.1%
|
0.1%
|
| JESD-30 Code |
R-PBGA-B4
|
R-PBGA-B4
|
| Length |
1.006 mm
|
1.006 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA4,2X2,20
|
BGA4,2X2,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.4 mm
|
0.4 mm
|
| Supply Current-Max |
0.3 mA
|
0.3 mA
|
| Supply Voltage-Max (Vsup) |
5 V
|
5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
0.93 mm
|
0.93 mm
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare LMV1012UP-07 with alternatives
Compare LMV1012UP-07/NOPB with alternatives