LP3991TLX-2.0
vs
LP3991TLX-2.0
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
VFBGA,
|
VFBGA, BGA4,2X2,20
|
| Pin Count |
4
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Dropout Voltage1-Max |
0.18 V
|
|
| Input Voltage-Max |
4 V
|
|
| Input Voltage-Min |
2.5 V
|
|
| JESD-30 Code |
R-PBGA-B4
|
R-PBGA-B4
|
| JESD-609 Code |
e1
|
e1
|
| Length |
1.446 mm
|
1.446 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Max |
2.06 V
|
|
| Output Voltage1-Min |
1.94 V
|
|
| Output Voltage1-Nom |
2 V
|
2 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.675 mm
|
0.675 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Voltage Tolerance-Max |
3%
|
3%
|
| Width |
0.963 mm
|
0.963 mm
|
| Base Number Matches |
2
|
2
|
| Adjustability |
|
FIXED
|
| Dropout Voltage1-Nom |
|
0.11 V
|
| Input Voltage Absolute-Max |
|
6.5 V
|
| Load Regulation-Max |
|
0.0179%
|
| Number of Outputs |
|
1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
BGA4,2X2,20
|
| Packing Method |
|
TR
|
| Technology |
|
CMOS
|
|
|
|