LP8552TLE-E06/NOPB
vs
IW3614-02-B3
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
DIALOG SEMICONDUCTOR GMBH
|
| Package Description |
BGA-25
|
SOIC-8
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Data Input Mode |
SERIAL
|
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
S-PBGA-B25
|
R-PDSO-G8
|
| JESD-609 Code |
e1
|
|
| Length |
2.46 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
|
| Multiplexed Display Capability |
NO
|
|
| Number of Channels |
6
|
|
| Number of Functions |
1
|
1
|
| Number of Segments |
12
|
12
|
| Number of Terminals |
25
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HLSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.675 mm
|
1.7 mm
|
| Supply Voltage-Max |
22 V
|
16 V
|
| Supply Voltage-Min |
5.5 V
|
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2.46 mm
|
3.9 mm
|
| fmax-Min |
1.25 MHz
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LP8552TLE-E06/NOPB with alternatives
Compare IW3614-02-B3 with alternatives