LP8860RQVFPRQ1
vs
LP8860BQVFPRQ1
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
HLQFP,
|
HLQFP-32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Date Of Intro |
2017-08-23
|
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Data Input Mode |
SERIAL
|
SERIAL
|
| Interface IC Type |
LED DISPLAY DRIVER
|
LED DISPLAY DRIVER
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| JESD-609 Code |
e4
|
e4
|
| Length |
7 mm
|
7 mm
|
| Moisture Sensitivity Level |
2
|
2
|
| Multiplexed Display Capability |
NO
|
NO
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Segments |
8
|
8
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLQFP
|
HLQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
7 mm
|
7 mm
|
| fmax-Min |
2.2 MHz
|
2.2 MHz
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare LP8860RQVFPRQ1 with alternatives
Compare LP8860BQVFPRQ1 with alternatives